THT
Through Hole Technology
THT (Through-Hole Technology)
is a well-established and proven assembly technique in electronics manufacturing that has been in use since the 1950s.
In this process, components with wire leads are inserted through metallised holes in the printed circuit board and then soldered in place.
THT is used in particular for components subject to mechanical stress, high-performance components or safety-critical components, and today it frequently complements SMT manufacturing in modern assemblies.
The solder wets the entire solder joint. A high-quality THT solder joint is characterised by the hole being sufficiently filled with solder and good wetting being visible on the top side of the printed circuit board.
This is often referred to as hole fill.
THT selective soldering – the benefits
Only the pins that actually need soldering are wetted. Sensitive components or existing SMT components are not subjected to unnecessary thermal stress.
On densely populated printed circuit boards with small spacing between components, the solder joint can be targeted with precision. – Reduced risk of solder bridges and defects.
Greater process flexibility
Different assemblies can be processed without the need for special soldering frames or complex adjustments. – Ideal for small and medium batch sizes.
Less masking required
In selective soldering, virtually no masking is required when certain components must not come into contact with the solder.
As only the necessary areas are soldered, less solder is used than with a continuous wave soldering process.
Reduced solder consumption
As only the necessary areas are soldered, less solder is used than with a continuous wave soldering process.
Lower thermal stress
The assembly is heated locally rather than over a large area. – This protects temperature-sensitive components and the PCB material.
Modern selective soldering systems store process parameters for each assembly. – This provides a solid foundation for quality documentation and Industry 4.0 applications.
Advantages of THT components and modules
With our selective soldering system for THT assemblies, we offer you the full added value of this technology:
Stability
Assembly
Thermics
High power
Shock resistancy
Re-work
1. Mechanical stability
As the wire connections of the components are fed through holes in the circuit board and soldered on the back, THT components are very robust. Their connections have a high mechanical strength, which makes them ideal for applications with high mechanical loads.
2. Mounting
THT components can be assembled easily and manually, especially for prototypes and small series production.
3. Good thermal qualities
THT components have good thermal properties, as the through-hole plating and the design ensure good heat dissipation. This is advantageous for applications with high power density.
4. High durability
Compared to SMT components, THT components can handle higher currents and voltages as they have larger and more robust designs. This makes them advantageous for power electronics.
5. Reliable in harsh environments
Thanks to their mechanical stability, THT circuits are more resistant to vibrations, shocks and strong temperature fluctuations. They are therefore well suited for applications in the aerospace, military and automotive industries.
6. Simple repair & rework
THT circuits are easy to repair or rework. The components can be easily removed and replaced, which is an advantage during maintenance because less electronic waste is produced in the long term.
Fields of application for THT components
Prototypes
Small batches
Aviation
High current
Automotive
Repair
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