SMD – Surface mounted device

Process & advantages
Compact
Automated
Cost efficient
Fast
Double-sided
RF applications
1. Compact design
SMD components are smaller than THT components. This enables a higher component density on the PCB, so that complex circuits require less space.
This leads to more compact and lighter devices and enables the miniaturisation of mobile devices such as smartphones in particular.
2. Automated production
SMD circuits can be easily assembled and soldered automatically. This reduces production costs and enables high precision.
This makes them ideal for mass production and increases efficiency in manufacturing.
3. Low production costs
By saving material and space, SMD circuits can be produced more cost-effectively than THT circuits, especially in large quantities.


4. High RF suitability
SMD components have shorter connections and are therefore less susceptible to inductive or capacitive parasitic effects. This allows greater electrical performance in HF applications and fast switching operations.
5. Double-sided assembly
As SMD components are not contacted through the PCB, double-sided assembly is possible. This increases design flexibility and allows more functions to be integrated in a smaller area.
6. Excellent thermal qualities
Direct mounting on the PCB enables better heat dissipation via the copper surfaces of the board. As a result, SMD components are cooled efficiently, which improves the performance of the circuit in relation to its size.
7. Higher production speed
As SMD circuits are manufactured automatically, they can be produced more quickly than THT circuits, which enables shorter delivery times.
AnwFields of application for SMD technology
Medical
Mass production
Lighting
Measurement
Communication
Testing
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